EXSHINE Part Number: | EX-TC75W59FU,LF |
---|---|
Manufacturer Part Number: | TC75W59FU,LF |
Manufacturer / Brand: | Toshiba Semiconductor and Storage |
Brief Description: | IC COMP GP CMOS DUAL SM8 |
Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
Condition: | New and unused, Original |
Datasheet Download: | TC75W59FU,FK |
Application: | - |
Weight: | - |
Alternative Replacement: | - |
Voltage - Supply, Single/Dual (±) | 1.8 V ~ 7 V, ±0.9 V ~ 3.5 V |
---|---|
Voltage - Input Offset (Max) | 1mV @ 5V |
Type | General Purpose |
Supplier Device Package | SM8 |
Series | - |
Propagation Delay (Max) | 200ns |
Packaging | Tape & Reel (TR) |
Package / Case | 8-TSSOP, 8-MSOP (0.110", 2.80mm Width) |
Output Type | Open Drain |
Other Names | TC75W59FU(TE12L,F) TC75W59FU(TE12LF)TR TC75W59FU(TE12LF)TR-ND TC75W59FU,LF(B TC75W59FU,LF(T TC75W59FULFTR |
Operating Temperature | -40°C ~ 85°C |
Number of Elements | 2 |
Mounting Type | Surface Mount |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Manufacturer Standard Lead Time | 12 Weeks |
Manufacturer Part Number | TC75W59FU,LF |
Hysteresis | - |
Expanded Description | Comparator General Purpose Open Drain SM8 |
Description | IC COMP GP CMOS DUAL SM8 |
Current - Quiescent (Max) | 220µA |
Current - Output (Typ) | 25mA |
Current - Input Bias (Max) | 1pA @ 5V |
CMRR, PSRR (Typ) | - |
Other Names | TC75W59FU(TE12L,F) TC75W59FU(TE12LF)TR TC75W59FU(TE12LF)TR-ND TC75W59FU,LF(B TC75W59FU,LF(T TC75W59FULFTR |
---|---|
Standard Package | 3,000 |
|
T/T (Bank Transfer) Receiving: 1-4 days. |
|
Paypal Receiving: immediately. |
|
Western Union Receiving: 1-2 hours. |
|
MoneyGram Receiving: 1-2 hours. |
|
Alipay Receiving: immediately. |
DHL EXPRESS Delivery time: 1-3 days. |
|
FEDEX EXPRESS Delivery time: 1-3 days. |
|
UPS EXPRESS Delivery time: 2-4 days. |
|
TNT EXPRESS Delivery time: 3-6 days. |
|
EMS EXPRESS Delivery time: 7-10 days. |
- Toshiba Semiconductor & Storage offers a broad range of enabling technology solutions that allow OEMs, ODMs, CMs and fabless chip companies to develop advanced integrated products for the computing, networking, communications, digital consumer, automotive and other markets.