TLP3042SCF

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TLP3042SCF

EXSHINE Part Number:EX-TLP3042SCF
Manufacturer Part Number:TLP3042SCF
Manufacturer / Brand:Toshiba Semiconductor and Storage
Brief Description:OPTOISOLATOR 5KV TRIAC 6DIP 5L
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Condition:New and unused, Original
Datasheet Download:TLP3041(S), 42(S), 43(S)Photocouplers/Relays Catalog -
Application:-
Weight:-
Alternative Replacement:-
Real Time Availability for
TLP3042SCF
In stock: 99858000 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks

Click below to order TLP3042SCF online

US$ 1.75

Reference Marketing Price: US$ 1.75

Our Best Price: N/A (Email us)

Minimum:1

Multiples:1

1+:
$1.75
10+:
$1.55
50+:
$1.15
100+:
$1.00
250+:
$0.90
500+:
$0.80
1000+:
$0.688
2500+:
$0.65
5000+:
$0.625
  • Description
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Product Parameter

Zero Crossing Circuit Yes
Voltage - Off State 400V
Voltage - Isolation 5000Vrms
Voltage - Forward (Vf) (Typ) 1.15V
Turn On Time -
Supplier Device Package 6-DIP (Cut), 5 Lead
Static dV/dt (Min) 200V/µs
Series -
Packaging Tube
Package / Case 6-DIP (0.300", 7.62mm), 5 Leads
Output Type Triac
Other Names TLP3042(S,C,F)
TLP3042(S,C,F,T)
TLP3042(SCF)
TLP3042(SCF)-ND
TLP3042SCFT
TLP3042SF
TLP3042SF-ND
Operating Temperature -40°C ~ 100°C
Number of Channels 1
Mounting Type Through Hole
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Manufacturer Standard Lead Time 8 Weeks
Manufacturer Part Number TLP3042SCF
Expanded Description Optoisolator Triac Output 5000Vrms 1 Channel 6-DIP (Cut), 5 Lead
Description OPTOISOLATOR 5KV TRIAC 6DIP 5L
Current - On State (It (RMS)) (Max) 100mA
Current - LED Trigger (Ift) (Max) 10mA
Current - Hold (Ih) 600µA (Typ)
Current - DC Forward (If) (Max) 50mA
Approvals BSI, SEMKO, UR

Others

Standard Package 50
Other Names TLP3042(S,C,F)

TLP3042(S,C,F,T)

TLP3042(SCF)

TLP3042(SCF)-ND

TLP3042SCFT

TLP3042SF

TLP3042SF-ND

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Distributor of Toshiba Semiconductor and Storage

- Toshiba Semiconductor & Storage offers a broad range of enabling technology solutions that allow OEMs, ODMs, CMs and fabless chip companies to develop advanced integrated products for the computing, networking, communications, digital consumer, automotive and other markets.

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