EXSHINE Part Number: | EX-TLP716(TP,F) |
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Manufacturer Part Number: | TLP716(TP,F) |
Manufacturer / Brand: | Toshiba Semiconductor and Storage |
Brief Description: | OPTOISO 5KV PUSH PULL 6DIP GW |
Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
Condition: | New and unused, Original |
Datasheet Download: | TLP716 Photocouplers/Relays Catalog - |
Application: | - |
Weight: | - |
Alternative Replacement: | - |
Voltage - Supply | 4.5 V ~ 5.5 V |
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Voltage - Isolation | 5000Vrms |
Voltage - Forward (Vf) (Typ) | 1.65V |
Supplier Device Package | 6-SDIP Gull Wing |
Series | - |
Rise / Fall Time (Typ) | 15ns, 15ns |
Propagation Delay tpLH / tpHL (Max) | 75ns, 75ns |
Packaging | Tape & Reel (TR) |
Package / Case | 6-SOIC (0.268", 6.80mm Width) |
Output Type | Push-Pull, Totem Pole |
Other Names | TLP716 (TP,F) TLP716(TPF)TR TLP716FTR TLP716FTR-ND TLP716TPF |
Operating Temperature | -40°C ~ 100°C |
Number of Channels | 1 |
Mounting Type | Surface Mount |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Manufacturer Standard Lead Time | 16 Weeks |
Manufacturer Part Number | TLP716(TP,F) |
Inputs - Side 1/Side 2 | 1/0 |
Input Type | DC |
Expanded Description | Logic Output Optoisolator 15MBd Push-Pull, Totem Pole 5000Vrms 1 Channel 10kV/µs CMTI 6-SDIP Gull Wing |
Description | OPTOISO 5KV PUSH PULL 6DIP GW |
Data Rate | 15MBd |
Current - Output / Channel | 10mA |
Current - DC Forward (If) (Max) | 20mA |
Common Mode Transient Immunity (Min) | 10kV/µs |
Other Names | TLP716 (TP,F) TLP716(TPF)TR TLP716FTR TLP716FTR-ND TLP716TPF |
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Standard Package | 1,500 |
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T/T (Bank Transfer) Receiving: 1-4 days. |
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Paypal Receiving: immediately. |
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Western Union Receiving: 1-2 hours. |
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MoneyGram Receiving: 1-2 hours. |
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Alipay Receiving: immediately. |
DHL EXPRESS Delivery time: 1-3 days. |
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FEDEX EXPRESS Delivery time: 1-3 days. |
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UPS EXPRESS Delivery time: 2-4 days. |
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TNT EXPRESS Delivery time: 3-6 days. |
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EMS EXPRESS Delivery time: 7-10 days. |
- Toshiba Semiconductor & Storage offers a broad range of enabling technology solutions that allow OEMs, ODMs, CMs and fabless chip companies to develop advanced integrated products for the computing, networking, communications, digital consumer, automotive and other markets.