W25Q256FVCIP

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W25Q256FVCIP

EXSHINE Part Number:EX-W25Q256FVCIP
Manufacturer Part Number:W25Q256FVCIP
Manufacturer / Brand:Winbond Electronics Corporation
Brief Description:IC FLASH 256MBIT 24TFBGA
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Condition:New and unused, Original
Datasheet Download:W25Q256FV
Application:-
Weight:-
Alternative Replacement:-
Real Time Availability for
W25Q256FVCIP
In stock: 90432 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks

Click below to order W25Q256FVCIP online

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  • Description
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  • Shipping
  • Packaging

Product Parameter

Voltage - Supply 2.7 V ~ 3.6 V
Supplier Device Package 24-TFBGA (6x8)
Speed 104MHz
Series SpiFlash®
Packaging Tube
Package / Case 24-TBGA
Operating Temperature -40°C ~ 85°C (TA)
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Memory Type Non-Volatile
Memory Size 256Mb (32M x 8)
Memory Format FLASH
Manufacturer Part Number W25Q256FVCIP
Interface SPI Serial
Description IC FLASH 256MBIT 24TFBGA

Others

Standard Package 480

You can choose the below payment options. Please contact our sales team if you have any questions.

 T/T (Bank Transfer)
 Receiving: 1-4 days.

 Paypal
 Receiving: immediately.

 Western Union
 Receiving: 1-2 hours.

 MoneyGram
 Receiving: 1-2 hours.

 Alipay
 Receiving: immediately.

You can choose the below shipping options, contact our sales team to check the shipping cost to your address.
If you don't want to use our shipping service, you can also arrange pick up from our warehouse or ship by your courier account.

 DHL EXPRESS
 Delivery time: 1-3 days.
 FEDEX EXPRESS
 Delivery time: 1-3 days.
 UPS EXPRESS
 Delivery time: 2-4 days.
 TNT EXPRESS
 Delivery time: 3-6 days.
 EMS EXPRESS
 Delivery time: 7-10 days.


Distributor of Winbond Electronics

- Winbond Electronics Corporation is a memory IC company engaged in design, manufacturing and sales service to provide its global customers top quality memory solutions. Winbond’s product lines include Code Storage Flash Memory, Serial and Parallel NAND, Specialty DRAM and Mobile DRAM.
Winbond products are widely used by companies in the IoT vertical markets such as computing, connected multimedia devices, automobile, networking systems and industrial. Winbond offers automotive and Industrial –Plus grade Flash and DRAM products with longevity support. Winbond has approximately 2,200 employees worldwide, that includes a 12-inch FAB at its headquarters in Taichung, Taiwan.

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