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XA7Z010-1CLG225I
| EXSHINE Part Number: | EX-XA7Z010-1CLG225I |
|---|---|
| Manufacturer Part Number: | XA7Z010-1CLG225I |
| Manufacturer / Brand: | Xilinx |
| Brief Description: | IC SOC CORTEX A-9 ZYNQ7 225BGA |
| Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
| Condition: | New and unused, Original |
| Datasheet Download: | Zynq-7000 All Progammable SoC DatasheetXA Zynq-7000 Overview |
| Application: | - |
| Weight: | - |
| Alternative Replacement: | - |
Real Time Availability for
XA7Z010-1CLG225I
In stock: 36900 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks
In stock: 36900 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks
- Description
- Payment
- Shipping
- Packaging
Product Parameter
| Supplier Device Package | 225-CSPBGA (13x13) |
|---|---|
| Speed | 667MHz |
| Series | Automotive, AEC-Q100, Zynq®-7000 XA |
| Primary Attributes | Artix™-7 FPGA, 28K Logic Cells |
| Peripherals | DMA |
| Packaging | Tray |
| Package / Case | 225-LFBGA, CSPBGA |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Number of I/O | 86 |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| Manufacturer Standard Lead Time | 6 Weeks |
| Manufacturer Part Number | XA7Z010-1CLG225I |
| MCU RAM | 256KB |
| MCU Flash | - |
| Expanded Description | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Automotive, AEC-Q100, Zynq®-7000 XA Artix™-7 FPGA, 28K Logic Cells 256KB 667MHz 225-CSPBGA (13x13) |
| Description | IC SOC CORTEX A-9 ZYNQ7 225BGA |
| Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| Connectivity | CAN, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Architecture | MCU, FPGA |
Others
| Standard Package | 1 |
|---|
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EMS EXPRESS Delivery time: 7-10 days. |
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- Xilinx is the leading provider of All Programmable FPGAs, SoCs, MPSoCs, and 3D ICs. Xilinx uniquely enables applications that are both software defined and hardware optimized – powering industry advancements in Cloud Computing, 5G Wireless, Embedded Vision, and Industrial IoT.