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XC17256EPDG8C
| EXSHINE Part Number: | EX-XC17256EPDG8C |
|---|---|
| Manufacturer Part Number: | XC17256EPDG8C |
| Manufacturer / Brand: | Xilinx |
| Brief Description: | IC PROM SERIAL 256K 8-DIP |
| Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
| Condition: | New and unused, Original |
| Datasheet Download: | Device Package Guide |
| Application: | - |
| Weight: | - |
| Alternative Replacement: | - |
Real Time Availability for
XC17256EPDG8C
In stock: 41532 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks
In stock: 41532 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks
- Description
- Payment
- Shipping
- Packaging
Product Parameter
| Voltage - Supply | 4.75 V ~ 5.25 V |
|---|---|
| Supplier Device Package | 8-PDIP |
| Series | - |
| Programmable Type | OTP |
| Packaging | Tube |
| Package / Case | 8-DIP (0.300", 7.62mm) |
| Other Names | 122-1576-5 |
| Operating Temperature | 0°C ~ 70°C |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Memory Size | 256Kb |
| Manufacturer Part Number | XC17256EPDG8C |
| Description | IC PROM SERIAL 256K 8-DIP |
Others
| Other Names | 122-1576-5 |
|---|---|
| Standard Package | 50 |
You can choose the below payment options. Please contact our sales team if you have any questions.
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T/T (Bank Transfer) Receiving: 1-4 days. |
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Western Union Receiving: 1-2 hours. |
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MoneyGram Receiving: 1-2 hours. |
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You can choose the below shipping options, contact our sales team to check the shipping cost to your address.
If you don't want to use our shipping service, you can also arrange pick up from our warehouse or ship by your courier account.
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DHL EXPRESS Delivery time: 1-3 days. |
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FEDEX EXPRESS Delivery time: 1-3 days. |
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UPS EXPRESS Delivery time: 2-4 days. |
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TNT EXPRESS Delivery time: 3-6 days. |
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EMS EXPRESS Delivery time: 7-10 days. |
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Distributor of Xilinx Inc.
- Xilinx is the leading provider of All Programmable FPGAs, SoCs, MPSoCs, and 3D ICs. Xilinx uniquely enables applications that are both software defined and hardware optimized – powering industry advancements in Cloud Computing, 5G Wireless, Embedded Vision, and Industrial IoT.