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XC7Z007S-1CLG225C
| EXSHINE Part Number: | EX-XC7Z007S-1CLG225C |
|---|---|
| Manufacturer Part Number: | XC7Z007S-1CLG225C |
| Manufacturer / Brand: | Xilinx |
| Brief Description: | IC FPGA SOC 100I/O 225BGA |
| Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
| Condition: | New and unused, Original |
| Datasheet Download: | Zynq-7000 All Progammable SoC DatasheetZynq-7000 All Programmable SoC OverviewZynq-7000 User Guide |
| Application: | - |
| Weight: | - |
| Alternative Replacement: | - |
Real Time Availability for
XC7Z007S-1CLG225C
In stock: 49130 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks
In stock: 49130 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks
- Description
- Payment
- Shipping
- Packaging
Product Parameter
| Supplier Device Package | 225-CSPBGA (13x13) |
|---|---|
| Speed | 667MHz |
| Series | Zynq®-7000 |
| Primary Attributes | Artix™-7 FPGA, 23K Logic Cells |
| Peripherals | DMA |
| Packaging | Tray |
| Package / Case | 225-LFBGA, CSPBGA |
| Other Names | 122-2002 |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Number of I/O | 54 |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Manufacturer Part Number | XC7Z007S-1CLG225C |
| MCU RAM | 256KB |
| MCU Flash | - |
| Expanded Description | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Zynq®-7000 Artix™-7 FPGA, 23K Logic Cells 256KB 667MHz 225-CSPBGA (13x13) |
| Description | IC FPGA SOC 100I/O 225BGA |
| Core Processor | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| Connectivity | CAN, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Architecture | MCU, FPGA |
Others
| Other Names | 122-2002 |
|---|---|
| Standard Package | 160 |
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EMS EXPRESS Delivery time: 7-10 days. |
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Distributor of Xilinx Inc.
- Xilinx is the leading provider of All Programmable FPGAs, SoCs, MPSoCs, and 3D ICs. Xilinx uniquely enables applications that are both software defined and hardware optimized – powering industry advancements in Cloud Computing, 5G Wireless, Embedded Vision, and Industrial IoT.