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XCV400E-6FG676C-0707
| EXSHINE Part Number: | EX-XCV400E-6FG676C-0707 |
|---|---|
| Manufacturer Part Number: | XCV400E-6FG676C-0707 |
| Manufacturer / Brand: | Xilinx |
| Brief Description: | XCV400E-6FG676C-0707 XILINX BGA new date code and low price |
| Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
| Condition: | 1 |
| Datasheet Download: | XCV400E-6FG676C-0707 |
| Application: | - |
| Weight: | - |
| Alternative Replacement: | - |
Real Time Availability for
XCV400E-6FG676C-0707
In stock: 43496 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks
In stock: 43496 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks
- Description
- Payment
- Shipping
- Packaging
Product Parameter
| Voltage | - |
|---|---|
| Series | XCV400E-6FG676 |
| Package Type | BGA |
| Operating Temperature | - |
| Mounting Type | - |
| Moisture Sensitivity Level (MSL) | 1 |
| MFG Part Code | XCV400E-6FG676C-0707 |
| Features | - |
| Dimension | - |
| Delivery Time | 1 Day |
| Date Code | New |
You can choose the below payment options. Please contact our sales team if you have any questions.
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T/T (Bank Transfer) Receiving: 1-4 days. |
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Paypal Receiving: immediately. |
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Western Union Receiving: 1-2 hours. |
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MoneyGram Receiving: 1-2 hours. |
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Alipay Receiving: immediately. |
You can choose the below shipping options, contact our sales team to check the shipping cost to your address.
If you don't want to use our shipping service, you can also arrange pick up from our warehouse or ship by your courier account.
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DHL EXPRESS Delivery time: 1-3 days. |
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FEDEX EXPRESS Delivery time: 1-3 days. |
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UPS EXPRESS Delivery time: 2-4 days. |
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TNT EXPRESS Delivery time: 3-6 days. |
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EMS EXPRESS Delivery time: 7-10 days. |
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Distributor of XILINX
- Xilinx is the leading provider of All Programmable FPGAs, SoCs, MPSoCs, and 3D ICs. Xilinx uniquely enables applications that are both software defined and hardware optimized – powering industry advancements in Cloud Computing, 5G Wireless, Embedded Vision, and Industrial IoT.