EXSHINE Part Number: | EX-FAM5-297-210-0.05-1A |
---|---|
Manufacturer Part Number: | FAM5-297-210-0.05-1A |
Manufacturer / Brand: | t-Global Technology |
Brief Description: | SHEET FAM5 210X297MM |
Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
Condition: | New and unused, Original |
Datasheet Download: | FAM Series Family Overview |
Application: | - |
Weight: | - |
Alternative Replacement: | - |
Width | 8.268" (210.00mm) |
---|---|
Type | Absorbing Sheet |
Thickness - Overall | 0.002" (0.05mm) |
Shape | Square |
Series | FAM5 |
Other Names | 1168-1407 FAM52972100051A |
Operating Temperature | -20°C ~ 80°C |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Material | - |
Manufacturer Standard Lead Time | 12 Weeks |
Manufacturer Part Number | FAM5-297-210-0.05-1A |
Length | 11.693" (297.00mm) |
Description | SHEET FAM5 210X297MM |
Adhesive | Non-Conductive, Single Sided |
Other Names | 1168-1407 FAM52972100051A |
---|---|
Standard Package | 1 |
|
T/T (Bank Transfer) Receiving: 1-4 days. |
|
Paypal Receiving: immediately. |
|
Western Union Receiving: 1-2 hours. |
|
MoneyGram Receiving: 1-2 hours. |
|
Alipay Receiving: immediately. |
![]() |
DHL EXPRESS Delivery time: 1-3 days. |
![]() |
FEDEX EXPRESS Delivery time: 1-3 days. |
![]() |
UPS EXPRESS Delivery time: 2-4 days. |
![]() |
TNT EXPRESS Delivery time: 3-6 days. |
![]() |
EMS EXPRESS Delivery time: 7-10 days. |
- t-Global Technology is a leading manufacturer and supplier of thermal management solutions. t-Global manufactures materials in their state of art facilities in Taiwan and the UK. Their broad product portfolio covers silicone and non-silicone gap fillers, silicone and non-silicone putties, ceramic heat spreaders, combined thermal and EMI absorbers and a wide selection of die-cut insulators. Taiwan is the central location for new product development and research and the UK takes responsibility for complex engineering projects, rapid prototyping and dispensing technology. t-Global’s philosophy is based around a very short lead-time and low MOQ’s, which translates into rapid prototyping and a short time to market.