EXSHINE Part Number: | EX-TG2030-150-150-2.0-0 |
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Manufacturer Part Number: | TG2030-150-150-2.0-0 |
Manufacturer / Brand: | t-Global Technology |
Brief Description: | TG SERIES SHEET 150X150X2MM |
Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
Condition: | New and unused, Original |
Datasheet Download: | TG2030 Series |
Application: | - |
Weight: | - |
Alternative Replacement: | - |
Usage | Sheet |
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Thickness | 0.079" (2.00mm) |
Thermal Resistivity | - |
Thermal Conductivity | 2.0 W/m-K |
Shape | Square |
Series | TG2030 |
Outline | 150.00mm x 150.00mm |
Other Names | 1168-1325 TG2030150150200 |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Material | Silicone Elastomer |
Manufacturer Standard Lead Time | 12 Weeks |
Manufacturer Part Number | TG2030-150-150-2.0-0 |
Expanded Description | Thermal Pad White 150.00mm x 150.00mm Square Tacky - Both Sides |
Description | TG SERIES SHEET 150X150X2MM |
Color | White |
Backing, Carrier | - |
Adhesive | Tacky - Both Sides |
Standard Package | 1 |
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Other Names | 1168-1325 TG2030150150200 |
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T/T (Bank Transfer) Receiving: 1-4 days. |
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Paypal Receiving: immediately. |
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Western Union Receiving: 1-2 hours. |
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MoneyGram Receiving: 1-2 hours. |
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Alipay Receiving: immediately. |
DHL EXPRESS Delivery time: 1-3 days. |
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FEDEX EXPRESS Delivery time: 1-3 days. |
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UPS EXPRESS Delivery time: 2-4 days. |
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TNT EXPRESS Delivery time: 3-6 days. |
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EMS EXPRESS Delivery time: 7-10 days. |
- t-Global Technology is a leading manufacturer and supplier of thermal management solutions. t-Global manufactures materials in their state of art facilities in Taiwan and the UK. Their broad product portfolio covers silicone and non-silicone gap fillers, silicone and non-silicone putties, ceramic heat spreaders, combined thermal and EMI absorbers and a wide selection of die-cut insulators. Taiwan is the central location for new product development and research and the UK takes responsibility for complex engineering projects, rapid prototyping and dispensing technology. t-Global’s philosophy is based around a very short lead-time and low MOQ’s, which translates into rapid prototyping and a short time to market.