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6105-B1K

EXSHINE Part Number:EX-6105-B1K
Manufacturer Part Number:6105-B1K
Manufacturer / Brand:3M
Brief Description:CONN FIBER ST PLUG SMPLX 125UM
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Condition:New and unused, Original
Datasheet Download:ST Connectors and Accessories Prod BriefFiber Optic Brochure
Application:-
Weight:-
Alternative Replacement:-
Real Time Availability for
6105-B1K
In stock: 15240 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks

Click below to order 6105-B1K online

US$ 1.958

Reference Marketing Price: US$ 1.958

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1000+:
$1.958
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Product Parameter

Simplex/Duplex Simplex
Series -
Reflection -25dB
Other Names 00051138704414
05113870441
80610993471
Operating Temperature -40°C ~ 85°C
Mounting Type Free Hanging (In-Line)
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Mode Multimode
Mating Cycles 1000
Manufacturer Standard Lead Time 3 Weeks
Manufacturer Part Number 6105-B1K
Ingress Protection -
Housing Material Zinc
Housing Color Silver
Fiber Core Diameter -
Fiber Cladding Diameter 125µm
Ferrule Material Zirconia
Features Dust Cap, Strain Relief
Fastening Type Bayonet Lock
Expanded Description Fiber Optic Plug Connector ST Simplex 125µm Silver
Description CONN FIBER ST PLUG SMPLX 125UM
Connector Type Plug
Connector Style ST
Cable Diameter 0.9mm
Boot Color Black
Body Material Zinc
Attenuation - Typ -0.2dB

Others

Other Names 00051138704414

05113870441

80610993471
Standard Package 1,000

You can choose the below payment options. Please contact our sales team if you have any questions.

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If you don't want to use our shipping service, you can also arrange pick up from our warehouse or ship by your courier account.

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 Delivery time: 3-6 days.
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 Delivery time: 7-10 days.


Distributor of 3M

- 3M offers innovative solutions to the electronics industry and is a leading manufacturer of interconnect solutions for board-to-board, wire-to-board, backplane and input/output (I/O) applications. These include 3M™ Wiremount Insulation Displacement Contact (IDC) Connectors, Mini Delta Ribbon (MDR) I/O System, Mini-Clamp Discrete Wire System, MetPak™ High Speed Hard Metric (HSHM) and the new Ultra Hard Metric (UHM) Backplane Connectors. Using industry leading capabilities in CAD - such as NX™ and SLA modeling - 3M's experienced engineers turn ideas into real world solutions.
3M offers solutions for printed circuit board fabrication, board assembly and test, such as adhesives and tapes, embedded capacitor materials, Textool™ Test and Burn-in Sockets, carrier and cover tapes and trays, flexible circuits, and products for reducing electrostatic discharge. 3M also offers solutions for shielding from EMI/RFI, for thermal management and vibration damping, as well as for packaging and labeling.
For more information on 3M's involvement with the electronics industry, visit www.3M.com/electronics. For interconnect solutions, visit www.3Mconnector.com.
3M, MetPak and Textool are trademarks of 3M Company. Other trademarks are the property of their respective owners.

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