8337-7003

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8337-7003

EXSHINE Part Number:EX-8337-7003
Manufacturer Part Number:8337-7003
Manufacturer / Brand:3M
Brief Description:CONN DSUB RCPT 37POS PNL MNT IDC
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Condition:New and unused, Original
Datasheet Download:8300 SeriesShort Form Catalog
Application:-
Weight:-
Alternative Replacement:-
Real Time Availability for
8337-7003
In stock: 66250 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks

Click below to order 8337-7003 online

US$ 8.936

Reference Marketing Price: US$ 8.936

Our Best Price: N/A (Email us)

Minimum:1

Multiples:1

100+:
$8.936
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Product Parameter

Wire Gauge 26-28 AWG
Voltage Rating -
Termination IDC, Ribbon Cable
Shell Size, Connector Layout 4 (DC, C)
Shell Material, Finish Steel, Tin Plated
Series 8300
Packaging Bulk
Other Names 05111165745
80610186423
Operating Temperature -55°C ~ 105°C
Number of Rows 2
Number of Positions 37
Mounting Type Panel Mount
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Material Flammability Rating UL94 V-0
Manufacturer Standard Lead Time 11 Weeks
Manufacturer Part Number 8337-7003
Ingress Protection -
Housing Material Polybutylene Terephthalate (PBT), Polyester, Glass Filled
Flange Feature Housing/Shell (4-40)
Features -
Expanded Description 37 Position D-Sub Receptacle, Female Sockets Connector, Panel Mount IDC, Ribbon Cable
Description CONN DSUB RCPT 37POS PNL MNT IDC
Current Rating 1A
Contact Type Signal
Contact Material Copper Alloy
Contact Form -
Contact Finish Thickness 30µin (0.76µm)
Contact Finish Gold
Connector Type Receptacle, Female Sockets
Connector Style D-Sub
Color Gray
Backset Spacing -

Others

Other Names 05111165745

80610186423
Standard Package 100

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Distributor of 3M

- 3M offers innovative solutions to the electronics industry and is a leading manufacturer of interconnect solutions for board-to-board, wire-to-board, backplane and input/output (I/O) applications. These include 3M™ Wiremount Insulation Displacement Contact (IDC) Connectors, Mini Delta Ribbon (MDR) I/O System, Mini-Clamp Discrete Wire System, MetPak™ High Speed Hard Metric (HSHM) and the new Ultra Hard Metric (UHM) Backplane Connectors. Using industry leading capabilities in CAD - such as NX™ and SLA modeling - 3M's experienced engineers turn ideas into real world solutions.
3M offers solutions for printed circuit board fabrication, board assembly and test, such as adhesives and tapes, embedded capacitor materials, Textool™ Test and Burn-in Sockets, carrier and cover tapes and trays, flexible circuits, and products for reducing electrostatic discharge. 3M also offers solutions for shielding from EMI/RFI, for thermal management and vibration damping, as well as for packaging and labeling.
For more information on 3M's involvement with the electronics industry, visit www.3M.com/electronics. For interconnect solutions, visit www.3Mconnector.com.
3M, MetPak and Textool are trademarks of 3M Company. Other trademarks are the property of their respective owners.

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