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0877822204

EXSHINE Part Number:EX-0877822204
Manufacturer Part Number:0877822204
Manufacturer / Brand:Affinity Medical Technologies - a Molex company
Brief Description:CONN SKT MINIDIMM 200POS SMD
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Condition:New and unused, Original
Datasheet Download:877822204
Application:-
Weight:-
Alternative Replacement:-
Real Time Availability for
0877822204
In stock: 14160 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks

Click below to order 0877822204 online

US$ 30.348

Reference Marketing Price: US$ 30.348

Our Best Price: N/A (Email us)

Minimum:1

Multiples:1

168+:
$30.348
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Product Parameter

Standards MO-258
Series 87782
Packaging Tray
Other Names 087782-2204
87782-2204
877822204
Number of Positions 200
Mounting Type Surface Mount
Mounting Feature Normal, Standard - Top
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Memory Type DDR SDRAM
Manufacturer Standard Lead Time 11 Weeks
Manufacturer Part Number 0877822204
Features Board Guide, Cover, Latches
Expanded Description 200 Position MiniDIMM DDR SDRAM Socket Surface Mount
Description CONN SKT MINIDIMM 200POS SMD
Contact Finish Thickness 30µin (0.76µm)
Contact Finish Gold
Connector Style MiniDIMM

Others

Other Names 087782-2204

87782-2204

877822204
Standard Package 168

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Distributor of Molex, LLC

- As a leading global supplier of electronic interconnects, Molex is focused on designing and developing innovative solutions critical to products that touch virtually every walk of life. Our portfolio is among the world’s largest with over 100,000 products, including everything from electrical and fiber optic interconnect solutions to switches and application tooling.
Molex serves customers in a variety of industries, including the telecom, datacom, computer / peripheral, automotive, premise wiring, industrial, consumer, medical and military markets. And because we have the highest levels of R&D investment in our industry, Molex is known for providing a continuous flow of innovation in areas such as high-speed signal integrity, miniaturization, higher power delivery, optical signal transmission and sealed harsh-environment connectivity.
For over 70 years, our focus has been on providing advanced products that meet tomorrow’s needs, today.

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