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0877823009

EXSHINE Part Number:EX-0877823009
Manufacturer Part Number:0877823009
Manufacturer / Brand:Affinity Medical Technologies - a Molex company
Brief Description:CONN SKT MINIDIMM 244POS SMD
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Condition:New and unused, Original
Datasheet Download:877823009 Drawing
Application:-
Weight:-
Alternative Replacement:-
Real Time Availability for
0877823009
In stock: 11720 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks

Click below to order 0877823009 online

US$ 9.149

Reference Marketing Price: US$ 9.149

Our Best Price: N/A (Email us)

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$9.149
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Product Parameter

Standards MO-244
Series 87782
Packaging Tray
Other Names 0877-82-3009
877-82-3009
87782-3009
877823009
Number of Positions 244
Mounting Type Surface Mount
Mounting Feature Normal, Standard - Top
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Memory Type DDR3 SDRAM
Manufacturer Standard Lead Time 8 Weeks
Manufacturer Part Number 0877823009
Features Board Guide, Cover, Latches
Expanded Description 244 Position MiniDIMM DDR3 SDRAM Socket Surface Mount
Description CONN SKT MINIDIMM 244POS SMD
Contact Finish Thickness 30µin (0.76µm)
Contact Finish Gold
Connector Style MiniDIMM

Others

Other Names 0877-82-3009

877-82-3009

87782-3009

877823009
Standard Package 154

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Distributor of Molex, LLC

- As a leading global supplier of electronic interconnects, Molex is focused on designing and developing innovative solutions critical to products that touch virtually every walk of life. Our portfolio is among the world’s largest with over 100,000 products, including everything from electrical and fiber optic interconnect solutions to switches and application tooling.
Molex serves customers in a variety of industries, including the telecom, datacom, computer / peripheral, automotive, premise wiring, industrial, consumer, medical and military markets. And because we have the highest levels of R&D investment in our industry, Molex is known for providing a continuous flow of innovation in areas such as high-speed signal integrity, miniaturization, higher power delivery, optical signal transmission and sealed harsh-environment connectivity.
For over 70 years, our focus has been on providing advanced products that meet tomorrow’s needs, today.

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