EXSHINE Part Number: | EX-HN1B01FU-GR,LF |
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Manufacturer Part Number: | HN1B01FU-GR,LF |
Manufacturer / Brand: | Toshiba Semiconductor and Storage |
Brief Description: | TRANS NPN/PNP 50V 0.15A US6-PLN |
Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
Condition: | New and unused, Original |
Datasheet Download: | HN1B01F |
Application: | - |
Weight: | - |
Alternative Replacement: | - |
Voltage - Collector Emitter Breakdown (Max) | 50V |
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Vce Saturation (Max) @ Ib, Ic | 250mV @ 10mA, 100mA |
Transistor Type | NPN, PNP |
Supplier Device Package | US6 |
Series | - |
Power - Max | 200mW, 210mW |
Packaging | Tape & Reel (TR) |
Package / Case | 6-TSSOP, SC-88, SOT-363 |
Other Names | HN1B01FU-GR(L,F,T) HN1B01FU-GR,LF(B HN1B01FU-GR,LF(T HN1B01FU-GRLF HN1B01FU-GRLF-ND HN1B01FUGRLFT HN1B01FUGRLFTTR HN1B01FUGRLFTTR-ND |
Operating Temperature | 125°C (TJ) |
Mounting Type | Surface Mount |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Manufacturer Standard Lead Time | 12 Weeks |
Manufacturer Part Number | HN1B01FU-GR,LF |
Frequency - Transition | 150MHz |
Expanded Description | Bipolar (BJT) Transistor Array NPN, PNP 50V 150mA 150MHz 200mW, 210mW Surface Mount US6 |
Description | TRANS NPN/PNP 50V 0.15A US6-PLN |
DC Current Gain (hFE) (Min) @ Ic, Vce | 200 @ 2mA, 6V |
Current - Collector Cutoff (Max) | 100nA (ICBO) |
Current - Collector (Ic) (Max) | 150mA |
Standard Package | 3,000 |
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Other Names | HN1B01FU-GR(L,F,T) HN1B01FU-GR,LF(B HN1B01FU-GR,LF(T HN1B01FU-GRLF HN1B01FU-GRLF-ND HN1B01FUGRLFT HN1B01FUGRLFTTR HN1B01FUGRLFTTR-ND |
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T/T (Bank Transfer) Receiving: 1-4 days. |
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Paypal Receiving: immediately. |
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Western Union Receiving: 1-2 hours. |
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MoneyGram Receiving: 1-2 hours. |
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Alipay Receiving: immediately. |
DHL EXPRESS Delivery time: 1-3 days. |
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FEDEX EXPRESS Delivery time: 1-3 days. |
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UPS EXPRESS Delivery time: 2-4 days. |
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TNT EXPRESS Delivery time: 3-6 days. |
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EMS EXPRESS Delivery time: 7-10 days. |
- Toshiba Semiconductor & Storage offers a broad range of enabling technology solutions that allow OEMs, ODMs, CMs and fabless chip companies to develop advanced integrated products for the computing, networking, communications, digital consumer, automotive and other markets.