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XCZU19EG-1FFVB1517E
| EXSHINE Part Number: | EX-XCZU19EG-1FFVB1517E |
|---|---|
| Manufacturer Part Number: | XCZU19EG-1FFVB1517E |
| Manufacturer / Brand: | Xilinx |
| Brief Description: | IC FPGA 644 I/O 1517FCBGA |
| Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
| Condition: | New and unused, Original |
| Datasheet Download: | Zynq UltraScale+ MPSoC Datasheet |
| Application: | - |
| Weight: | - |
| Alternative Replacement: | - |
Real Time Availability for
XCZU19EG-1FFVB1517E
In stock: 2650 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks
In stock: 2650 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks
- Description
- Payment
- Shipping
- Packaging
Product Parameter
| Supplier Device Package | 1517-FCBGA (40x40) |
|---|---|
| Speed | 600MHz, 1.5GHz |
| Series | Zynq® UltraScale+™ MPSoC EG |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells |
| Peripherals | DMA, WDT |
| Packaging | Tray |
| Package / Case | 1517-BBGA, FCBGA |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Number of I/O | 644 |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| Manufacturer Part Number | XCZU19EG-1FFVB1517E |
| MCU RAM | 256KB |
| MCU Flash | - |
| Expanded Description | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC EG Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells 256KB 600MHz, 1.5GHz 1517-FCBGA (40x40) |
| Description | IC FPGA 644 I/O 1517FCBGA |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ |
| Connectivity | CAN, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Architecture | MCU, FPGA |
Others
| Standard Package | 1 |
|---|
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EMS EXPRESS Delivery time: 7-10 days. |
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Distributor of Xilinx Inc.
- Xilinx is the leading provider of All Programmable FPGAs, SoCs, MPSoCs, and 3D ICs. Xilinx uniquely enables applications that are both software defined and hardware optimized – powering industry advancements in Cloud Computing, 5G Wireless, Embedded Vision, and Industrial IoT.