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DS34S132GN

EXSHINE Part Number:EX-DS34S132GN
Manufacturer Part Number:DS34S132GN
Manufacturer / Brand:Maxim Integrated
Brief Description:IC TDM/PACKET TRANSPORT 676BGA
Lead Free Status / RoHS Status:Contains lead / RoHS non-compliant
Condition:New and unused, Original
Datasheet Download:DS34S132
Application:-
Weight:-
Alternative Replacement:-
Real Time Availability for
DS34S132GN
In stock: 45501 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks

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Product Parameter

Voltage - Supply 1.8V, 3.3V
Supplier Device Package 676-PBGA (27x27)
Series -
Power (Watts) -
Packaging Tray
Package / Case 676-BGA
Operating Temperature -40°C ~ 85°C
Number of Circuits 1
Mounting Type Surface Mount
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Manufacturer Part Number DS34S132GN
Interface TDMoP
Includes -
Function TDM-over-Packet (TDMoP)
Expanded Description Telecom IC TDM-over-Packet (TDMoP) 676-PBGA (27x27)
Description IC TDM/PACKET TRANSPORT 676BGA
Current - Supply -

Others

Standard Package 1

You can choose the below payment options. Please contact our sales team if you have any questions.

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If you don't want to use our shipping service, you can also arrange pick up from our warehouse or ship by your courier account.

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 Delivery time: 7-10 days.


Distributor of Maxim Integrated

- The market is evolving. The rules are changing. To keep your time to market short, you need integration at every level—from silicon to the supply chain.
Count on Maxim Integrated to help you overcome design and architectural challenges, with integrated solutions for the industrial, medical, consumer, automotive, energy, computing, and communications realms.
Maxim Integrated is also your source for power, interface, and even digital products that work in the analog world. And they’re glad to support you with reference designs, tools, technical documents, packaging, and more. We invite you to explore their latest analog integration offerings.

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