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DS34S132GNA2+

EXSHINE Part Number:EX-DS34S132GNA2+
Manufacturer Part Number:DS34S132GNA2+
Manufacturer / Brand:Maxim Integrated
Brief Description:IC 32PORT TDM OVER PACKET 676BGA
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Condition:New and unused, Original
Datasheet Download:DS34S132
Application:-
Weight:-
Alternative Replacement:-
Real Time Availability for
DS34S132GNA2+
In stock: 8419 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks

Click below to order DS34S132GNA2+ online

US$ 174.86

Reference Marketing Price: US$ 174.86

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Multiples:1

40+:
$174.86
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Product Parameter

Voltage - Supply 1.8V, 3.3V
Supplier Device Package 676-PBGA (27x27)
Series -
Power (Watts) -
Packaging Tray
Package / Case 676-BGA
Operating Temperature -40°C ~ 85°C
Number of Circuits 1
Mounting Type Surface Mount
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Manufacturer Standard Lead Time 15 Weeks
Manufacturer Part Number DS34S132GNA2+
Interface TDMoP
Includes -
Function TDM-over-Packet (TDMoP)
Expanded Description Telecom IC TDM-over-Packet (TDMoP) 676-PBGA (27x27)
Description IC 32PORT TDM OVER PACKET 676BGA
Current - Supply -

Others

Standard Package 40

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Distributor of Maxim Integrated

- The market is evolving. The rules are changing. To keep your time to market short, you need integration at every level—from silicon to the supply chain.
Count on Maxim Integrated to help you overcome design and architectural challenges, with integrated solutions for the industrial, medical, consumer, automotive, energy, computing, and communications realms.
Maxim Integrated is also your source for power, interface, and even digital products that work in the analog world. And they’re glad to support you with reference designs, tools, technical documents, packaging, and more. We invite you to explore their latest analog integration offerings.

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