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DS34T101GN

EXSHINE Part Number:EX-DS34T101GN
Manufacturer Part Number:DS34T101GN
Manufacturer / Brand:Maxim Integrated
Brief Description:IC TDM/PACKET CHIP 484-BGA
Lead Free Status / RoHS Status:Contains lead / RoHS non-compliant
Condition:New and unused, Original
Datasheet Download:DS34T101,102,104,108
Application:-
Weight:-
Alternative Replacement:-
Real Time Availability for
DS34T101GN
In stock: 31628 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks

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  • Description
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Product Parameter

Type TDM (Time Division Multiplexing)
Supplier Device Package 484-TEBGA (23x23)
Series -
Packaging Tray
Package / Case 484-BGA
Mounting Type Surface Mount
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Manufacturer Part Number DS34T101GN
Expanded Description TDM (Time Division Multiplexing) IC Data Transport 484-TEBGA (23x23)
Description IC TDM/PACKET CHIP 484-BGA
Applications Data Transport

Others

Standard Package 30

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Distributor of Maxim Integrated

- The market is evolving. The rules are changing. To keep your time to market short, you need integration at every level—from silicon to the supply chain.
Count on Maxim Integrated to help you overcome design and architectural challenges, with integrated solutions for the industrial, medical, consumer, automotive, energy, computing, and communications realms.
Maxim Integrated is also your source for power, interface, and even digital products that work in the analog world. And they’re glad to support you with reference designs, tools, technical documents, packaging, and more. We invite you to explore their latest analog integration offerings.

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