11007

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EXSHINE Part Number:	EX-11007
Manufacturer Part Number:	11007
Manufacturer / Brand:	3M
Brief Description:	CONN SPLICE 3/0 AWG CRIMP
Lead Free Status / RoHS Status:	Lead free / RoHS Compliant
Condition:	New and unused, Original
Datasheet Download:	Scotchlok™ 10000, 11000 Series Datasheet
Application:	-
Weight:	-
Alternative Replacement:	-

Real Time Availability for

11007
In stock: 84710 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks

Description
Payment
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Packaging

Product Parameter

Wire Gauge	3/0 AWG
Termination	Crimp
Terminal Type	Butt Splice, Inline, Individual Openings
Series	Scotchlok™
Packaging	Bulk
Other Names	00054007128083 05400712808 110073M 80610033120
Number of Wire Entries	2
Moisture Sensitivity Level (MSL)	1 (Unlimited)
Manufacturer Standard Lead Time	3 Weeks
Manufacturer Part Number	11007
Insulation	Non-Insulated
Features	Copper Wire Only
Expanded Description	Terminal Butt Splice, Inline, Individual Openings Connector Crimp 3/0 AWG Orange
Description	CONN SPLICE 3/0 AWG CRIMP
Color	Orange

Others

Standard Package	10
Other Names	00054007128083 05400712808 110073M 80610033120

You can choose the below payment options. Please contact our sales team if you have any questions.

	T/T (Bank Transfer) Receiving: 1-4 days.
	Paypal Receiving: immediately.
	Western Union Receiving: 1-2 hours.
	MoneyGram Receiving: 1-2 hours.
	Alipay Receiving: immediately.

You can choose the below shipping options, contact our sales team to check the shipping cost to your address.

If you don't want to use our shipping service, you can also arrange pick up from our warehouse or ship by your courier account.

	DHL EXPRESS Delivery time: 1-3 days.
	FEDEX EXPRESS Delivery time: 1-3 days.
	UPS EXPRESS Delivery time: 2-4 days.
	TNT EXPRESS Delivery time: 3-6 days.
	EMS EXPRESS Delivery time: 7-10 days.

Distributor of 3M

- 3M offers innovative solutions to the electronics industry and is a leading manufacturer of interconnect solutions for board-to-board, wire-to-board, backplane and input/output (I/O) applications. These include 3M™ Wiremount Insulation Displacement Contact (IDC) Connectors, Mini Delta Ribbon (MDR) I/O System, Mini-Clamp Discrete Wire System, MetPak™ High Speed Hard Metric (HSHM) and the new Ultra Hard Metric (UHM) Backplane Connectors. Using industry leading capabilities in CAD - such as NX™ and SLA modeling - 3M's experienced engineers turn ideas into real world solutions.
3M offers solutions for printed circuit board fabrication, board assembly and test, such as adhesives and tapes, embedded capacitor materials, Textool™ Test and Burn-in Sockets, carrier and cover tapes and trays, flexible circuits, and products for reducing electrostatic discharge. 3M also offers solutions for shielding from EMI/RFI, for thermal management and vibration damping, as well as for packaging and labeling.
For more information on 3M's involvement with the electronics industry, visit www.3M.com/electronics. For interconnect solutions, visit www.3Mconnector.com.
3M, MetPak and Textool are trademarks of 3M Company. Other trademarks are the property of their respective owners.

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