922309

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922309

EXSHINE Part Number:EX-922309
Manufacturer Part Number:922309
Manufacturer / Brand:3M
Brief Description:BREADBOARD SOLDERLESS ACE309
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Condition:New and unused, Original
Datasheet Download:Solderless Breadboards and Accessories
Application:-
Weight:-
Alternative Replacement:-
Real Time Availability for
922309
In stock: 35050 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks

Click below to order 922309 online

US$ 48.48

Reference Marketing Price: US$ 48.48

Our Best Price: N/A (Email us)

Minimum:1

Multiples:1

1+:
$48.48
5+:
$45.706
10+:
$44.32
  • Description
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Product Parameter

Wire Gauge 22 AWG
Type Assembly (On Frame)
Size / Dimension 7.00" x 4.00" (177.8mm x 101.6mm)
Series 300
Other Names 5113827787
51138277871
80-6103-6263-6
80610362636
Number of Tie Points (Total) 840
Number of Terminal Strips 1
Number of Distribution Buses 2
Number of Binding Posts 3
Number of 5-Tie Point Terminals 128
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Manufacturer Standard Lead Time 3 Weeks
Manufacturer Part Number 922309
Includes -
Expanded Description Solderless Breadboard Assembly (On Frame) 7.00" x 4.00" (177.8mm x 101.6mm)
Description BREADBOARD SOLDERLESS ACE309

Others

Other Names 5113827787

51138277871

80-6103-6263-6

80610362636
Standard Package 10

You can choose the below payment options. Please contact our sales team if you have any questions.

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If you don't want to use our shipping service, you can also arrange pick up from our warehouse or ship by your courier account.

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 Delivery time: 2-4 days.
 TNT EXPRESS
 Delivery time: 3-6 days.
 EMS EXPRESS
 Delivery time: 7-10 days.


Distributor of 3M

- 3M offers innovative solutions to the electronics industry and is a leading manufacturer of interconnect solutions for board-to-board, wire-to-board, backplane and input/output (I/O) applications. These include 3M™ Wiremount Insulation Displacement Contact (IDC) Connectors, Mini Delta Ribbon (MDR) I/O System, Mini-Clamp Discrete Wire System, MetPak™ High Speed Hard Metric (HSHM) and the new Ultra Hard Metric (UHM) Backplane Connectors. Using industry leading capabilities in CAD - such as NX™ and SLA modeling - 3M's experienced engineers turn ideas into real world solutions.
3M offers solutions for printed circuit board fabrication, board assembly and test, such as adhesives and tapes, embedded capacitor materials, Textool™ Test and Burn-in Sockets, carrier and cover tapes and trays, flexible circuits, and products for reducing electrostatic discharge. 3M also offers solutions for shielding from EMI/RFI, for thermal management and vibration damping, as well as for packaging and labeling.
For more information on 3M's involvement with the electronics industry, visit www.3M.com/electronics. For interconnect solutions, visit www.3Mconnector.com.
3M, MetPak and Textool are trademarks of 3M Company. Other trademarks are the property of their respective owners.

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