DP600NS-GRAY-NON-SAG-50ML

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EXSHINE Part Number:	EX-DP600NS-GRAY-NON-SAG-50ML
Manufacturer Part Number:	DP600NS-GRAY-NON-SAG-50ML
Manufacturer / Brand:	3M
Brief Description:	CNCRTE RPR DP-600 NON-SAG GRY 50
Lead Free Status / RoHS Status:	Lead free / RoHS Compliant
Condition:	New and unused, Original
Datasheet Download:	Adhesive & Tape Design Guide DP600(NS) Datasheet
Application:	-
Weight:	-
Alternative Replacement:	-

Real Time Availability for

DP600NS-GRAY-NON-SAG-50ML
In stock: 12980 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks

Description
Payment
Shipping
Packaging

Product Parameter

Type	Epoxy Adhesive, 2 Part
Shipping Info	-
Series	Scotch-Weld™
Other Names	00021200566066 02120056606 62265250308 DP600-GRAY-50CC DP600-GRAY-50CC-ND
Moisture Sensitivity Level (MSL)	1 (Unlimited)
Manufacturer Standard Lead Time	3 Weeks
Manufacturer Part Number	DP600NS-GRAY-NON-SAG-50ML
For Use With/Related Products	Multi-Purpose
Features	-
Description	CNCRTE RPR DP-600 NON-SAG GRY 50

Others

Other Names	00021200566066 02120056606 62265250308 DP600-GRAY-50CC DP600-GRAY-50CC-ND
Standard Package	12

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	Paypal Receiving: immediately.
	Western Union Receiving: 1-2 hours.
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	Alipay Receiving: immediately.

You can choose the below shipping options, contact our sales team to check the shipping cost to your address.

If you don't want to use our shipping service, you can also arrange pick up from our warehouse or ship by your courier account.

	DHL EXPRESS Delivery time: 1-3 days.
	FEDEX EXPRESS Delivery time: 1-3 days.
	UPS EXPRESS Delivery time: 2-4 days.
	TNT EXPRESS Delivery time: 3-6 days.
	EMS EXPRESS Delivery time: 7-10 days.

Distributor of 3M

- 3M offers innovative solutions to the electronics industry and is a leading manufacturer of interconnect solutions for board-to-board, wire-to-board, backplane and input/output (I/O) applications. These include 3M™ Wiremount Insulation Displacement Contact (IDC) Connectors, Mini Delta Ribbon (MDR) I/O System, Mini-Clamp Discrete Wire System, MetPak™ High Speed Hard Metric (HSHM) and the new Ultra Hard Metric (UHM) Backplane Connectors. Using industry leading capabilities in CAD - such as NX™ and SLA modeling - 3M's experienced engineers turn ideas into real world solutions.
3M offers solutions for printed circuit board fabrication, board assembly and test, such as adhesives and tapes, embedded capacitor materials, Textool™ Test and Burn-in Sockets, carrier and cover tapes and trays, flexible circuits, and products for reducing electrostatic discharge. 3M also offers solutions for shielding from EMI/RFI, for thermal management and vibration damping, as well as for packaging and labeling.
For more information on 3M's involvement with the electronics industry, visit www.3M.com/electronics. For interconnect solutions, visit www.3Mconnector.com.
3M, MetPak and Textool are trademarks of 3M Company. Other trademarks are the property of their respective owners.

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