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SIL08E471J

EXSHINE Part Number:EX-SIL08E471J
Manufacturer Part Number:SIL08E471J
Manufacturer / Brand:AMP Connectors / TE Connectivity
Brief Description:RES ARRAY 7 RES 470 OHM 8SIP
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Condition:1
Datasheet Download:1622804 DrawingSIL Resistor Networks Datasheet
Application:-
Weight:-
Alternative Replacement:-
Real Time Availability for
SIL08E471J
In stock: 60452000 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks

Click below to order SIL08E471J online

US$ 0.122

Reference Marketing Price: US$ 0.122

Our Best Price: N/A (Email us)

Minimum:1

Multiples:1

3000+:
$0.122
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Product Parameter

Tolerance ±5%
Temperature Coefficient ±200ppm/°C
Supplier Device Package -
Size / Dimension 0.800" L x 0.098" W (20.32mm x 2.50mm)
Series SIL, Citec
Resistance (Ohms) 470
Power Per Element 200mW
Packaging Bulk
Package / Case 8-SIP
Other Names 4-1622804-6
4-1622804-6-ND
Operating Temperature -55°C ~ 125°C
Number of Resistors 7
Number of Pins 8
Mounting Type Through Hole
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Manufacturer Standard Lead Time 19 Weeks
Manufacturer Part Number SIL08E471J
Height - Seated (Max) 0.200" (5.08mm)
Expanded Description 470 Ohm ±5% 200mW Power Per Element Bussed Resistor Network/Array ±200ppm/°C 8-SIP
Description RES ARRAY 7 RES 470 OHM 8SIP
Circuit Type Bussed
Applications -

Others

Other Names 4-1622804-6

4-1622804-6-ND
Standard Package 1,000

You can choose the below payment options. Please contact our sales team if you have any questions.

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 Delivery time: 3-6 days.
 EMS EXPRESS
 Delivery time: 7-10 days.


Distributor of TE Connectivity Passive Product

- TE Connectivity AMP, formerly Tyco Electronics AMP is the world's leader in the development and manufacture of a wide variety of electronic/electrical connectors and interconnection systems. Products range from terminals and splices to sophisticated high speed printed circuit board connectors and IC sockets, to USB and Circular Connectors.

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