HCPL-2219

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HCPL-2219

EXSHINE Part Number:EX-HCPL-2219
Manufacturer Part Number:HCPL-2219
Manufacturer / Brand:Avago Technologies (Broadcom Limited)
Brief Description:OPTOISO 3.75KV TRI-STATE 8DIP
Lead Free Status / RoHS Status:Contains lead / RoHS non-compliant
Condition:New and unused, Original
Datasheet Download:HCPL-2200, HCPL-2219
Application:-
Weight:-
Alternative Replacement:-
Real Time Availability for
HCPL-2219
In stock: 95820 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks

Click below to order HCPL-2219 online

US$ 2.381

Reference Marketing Price: US$ 2.381

Our Best Price: N/A (Email us)

Minimum:1

Multiples:1

1400+:
$2.381
  • Description
  • Payment
  • Shipping
  • Packaging

Product Parameter

Voltage - Supply 4.5 V ~ 20 V
Voltage - Isolation 3750Vrms
Voltage - Forward (Vf) (Typ) 1.5V
Supplier Device Package 8-DIP
Series -
Rise / Fall Time (Typ) 55ns, 15ns
Propagation Delay tpLH / tpHL (Max) 300ns, 300ns
Packaging Tube
Package / Case 8-DIP (0.300", 7.62mm)
Output Type Tri-State
Operating Temperature -40°C ~ 85°C
Number of Channels 1
Mounting Type Through Hole
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Manufacturer Standard Lead Time 8 Weeks
Manufacturer Part Number HCPL-2219
Inputs - Side 1/Side 2 1/0
Input Type DC
Expanded Description Logic Output Optoisolator 2.5MBd Tri-State 3750Vrms 1 Channel 2.5kV/µs CMTI 8-DIP
Description OPTOISO 3.75KV TRI-STATE 8DIP
Data Rate 2.5MBd
Current - Output / Channel 25mA
Current - DC Forward (If) (Max) 10mA
Common Mode Transient Immunity (Min) 2.5kV/µs

Others

Standard Package 50

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Distributor of Broadcom Limited

- Broadcom Limited is a diversified global semiconductor leader built on 50 years of innovation, collaboration and engineering excellence. Broadcom’s extensive product portfolio serves multiple applications within four primary end markets: wired infrastructure, wireless communications, enterprise storage and industrial & others. Applications for our products in these end markets include: data center networking, home connectivity, broadband access, telecommunications equipment, smartphones and base stations, data center servers and storage, factory automation, power generation and alternative energy systems, and displays.

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