0077001402

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0077001402

EXSHINE Part Number:EX-0077001402
Manufacturer Part Number:0077001402
Manufacturer / Brand:Laird Technologies - EMI
Brief Description:GASKET BECU ALLOY 15.24X609.6MM
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Condition:New and unused, Original
Datasheet Download:0077-0014-02 Spec0077-0014 DrawingNo Snag Series, Fingerstock GasketsEMI Catalog
Application:-
Weight:-
Alternative Replacement:-
Real Time Availability for
0077001402
In stock: 36700 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks

Click below to order 0077001402 online

US$ 13.41

Reference Marketing Price: US$ 13.41

Our Best Price: N/A (Email us)

Minimum:1

Multiples:1

1+:
$13.41
10+:
$12.073
25+:
$11.00
100+:
$9.927
250+:
$9.122
500+:
$8.317
1000+:
$7.244
  • Description
  • Payment
  • Shipping
  • Packaging

Product Parameter

Width 0.600" (15.24mm)
Type Fingerstock
Shape -
Series No Snag
Plating - Thickness -
Plating -
Other Names 77001402
903-1161
Operating Temperature 121°C
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Material Beryllium Copper
Manufacturer Standard Lead Time 4 Weeks
Manufacturer Part Number 0077001402
Length 24.000" (609.60mm)
Height 0.220" (5.59mm)
Description GASKET BECU ALLOY 15.24X609.6MM
Attachment Method Adhesive

Others

Standard Package 20
Other Names 77001402

903-1161

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Distributor of Laird Technologies EMI

Laird Technologies is an industry-leading EMI solutions provider, supplying innovative design through the manufacture of customized, performance-critical products in every available material and form factor. Products include board-level shields, combination shields, ferrite shields, EMI gaskets, vent panels and shielded windows, finger gaskets, and conductive elastomers, as well as Fabric-Over-Foam gaskets, Form-In-Place gaskets, and conductive foam and fabric. Laird Technologies constantly invents and perfects new materials, processes, and products to solve EMI problems. Customized product solutions are designed for customers in all markets of the electronics and wireless industries including the computing, telecommunications, data transfer and information technology, automotive, consumer, aerospace, defense, medical, and industrial markets.

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