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21451259
| EXSHINE Part Number: | EX-21451259 |
|---|---|
| Manufacturer Part Number: | 21451259 |
| Manufacturer / Brand: | Laird Technologies - EMI |
| Brief Description: | ABSORB SHEET DSF-3.0/SS6M 12X36 |
| Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
| Condition: | New and unused, Original |
| Datasheet Download: | Eccosorb® DSF Series Datasheet |
| Application: | - |
| Weight: | - |
| Alternative Replacement: | - |
In stock: 55930 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks
- Description
- Payment
- Shipping
- Packaging
Product Parameter
| Series | * |
|---|---|
| Other Names | DSF-3.0/SS6M 12X36 |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Manufacturer Part Number | 21451259 |
| Description | ABSORB SHEET DSF-3.0/SS6M 12X36 |
Others
| Standard Package | 1 |
|---|---|
| Other Names | DSF-3.0/SS6M 12X36 |
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T/T (Bank Transfer) Receiving: 1-4 days. |
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Paypal Receiving: immediately. |
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Western Union Receiving: 1-2 hours. |
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MoneyGram Receiving: 1-2 hours. |
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Alipay Receiving: immediately. |
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DHL EXPRESS Delivery time: 1-3 days. |
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FEDEX EXPRESS Delivery time: 1-3 days. |
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UPS EXPRESS Delivery time: 2-4 days. |
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TNT EXPRESS Delivery time: 3-6 days. |
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EMS EXPRESS Delivery time: 7-10 days. |
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Distributor of Laird Technologies EMI
Laird Technologies is an industry-leading EMI solutions provider, supplying innovative design through the manufacture of customized, performance-critical products in every available material and form factor. Products include board-level shields, combination shields, ferrite shields, EMI gaskets, vent panels and shielded windows, finger gaskets, and conductive elastomers, as well as Fabric-Over-Foam gaskets, Form-In-Place gaskets, and conductive foam and fabric. Laird Technologies constantly invents and perfects new materials, processes, and products to solve EMI problems. Customized product solutions are designed for customers in all markets of the electronics and wireless industries including the computing, telecommunications, data transfer and information technology, automotive, consumer, aerospace, defense, medical, and industrial markets.