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LCMXO640E-3FTN256C
| EXSHINE Part Number: | EX-LCMXO640E-3FTN256C |
|---|---|
| Manufacturer Part Number: | LCMXO640E-3FTN256C |
| Manufacturer / Brand: | Lattice Semiconductor |
| Brief Description: | IC FPGA 159 I/O 256FTBGA |
| Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
| Condition: | New and unused, Original |
| Datasheet Download: | LCMXO_MachXO Family DatasheetPackage Diagrams |
| Application: | - |
| Weight: | - |
| Alternative Replacement: | - |
Real Time Availability for
LCMXO640E-3FTN256C
In stock: 31270 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks
In stock: 31270 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks
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- Packaging
Product Parameter
| Voltage - Supply | 1.14 V ~ 1.26 V |
|---|---|
| Supplier Device Package | 256-FTBGA (17x17) |
| Series | MachXO |
| Package / Case | 256-LBGA |
| Other Names | 220-1535 LCMXO640E-3FTN256C-ND LCMXO640E3FTN256C |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Number of Logic Elements/Cells | 640 |
| Number of LABs/CLBs | 80 |
| Number of I/O | 159 |
| Mounting Type | Surface Mount |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Manufacturer Standard Lead Time | 8 Weeks |
| Manufacturer Part Number | LCMXO640E-3FTN256C |
| Description | IC FPGA 159 I/O 256FTBGA |
Others
| Standard Package | 90 |
|---|---|
| Other Names | 220-1535 LCMXO640E-3FTN256C-ND LCMXO640E3FTN256C |
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FEDEX EXPRESS Delivery time: 1-3 days. |
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UPS EXPRESS Delivery time: 2-4 days. |
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TNT EXPRESS Delivery time: 3-6 days. |
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EMS EXPRESS Delivery time: 7-10 days. |
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Distributor of Lattice Semiconductor Corporation
- Lattice Semiconductor, founded in 1983 and headquartered in Portland, Oregon, is the global leader in smart connectivity solutions. They provide market leading intellectual property and low-power, small form-factor devices that enable more than 8,000 global customers to quickly deliver innovative and differentiated cost and power efficient products. The Company's broad end-market exposure extends from consumer electronics to industrial equipment, communications infrastructure and licensing.
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