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LFE2M50E-5FN672C
| EXSHINE Part Number: | EX-LFE2M50E-5FN672C |
|---|---|
| Manufacturer Part Number: | LFE2M50E-5FN672C |
| Manufacturer / Brand: | Lattice Semiconductor |
| Brief Description: | IC FPGA 372 I/O 672FBGA |
| Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
| Condition: | New and unused, Original |
| Datasheet Download: | Product Selector GuideECP2(M) Family HandbookECP2(M) Family |
| Application: | - |
| Weight: | - |
| Alternative Replacement: | - |
Real Time Availability for
LFE2M50E-5FN672C
In stock: 5390 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks
In stock: 5390 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks
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- Payment
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- Packaging
Product Parameter
| Voltage - Supply | 1.14 V ~ 1.26 V |
|---|---|
| Total RAM Bits | 4246528 |
| Supplier Device Package | 672-FPBGA (27x27) |
| Series | ECP2M |
| Package / Case | 672-BBGA |
| Other Names | 220-1758 LFE2M50E-5FN672C-ND LFE2M50E5FN672C |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Number of Logic Elements/Cells | 48000 |
| Number of LABs/CLBs | 6000 |
| Number of I/O | 372 |
| Mounting Type | Surface Mount |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Manufacturer Standard Lead Time | 8 Weeks |
| Manufacturer Part Number | LFE2M50E-5FN672C |
| Description | IC FPGA 372 I/O 672FBGA |
Others
| Standard Package | 40 |
|---|---|
| Other Names | 220-1758 LFE2M50E-5FN672C-ND LFE2M50E5FN672C |
You can choose the below payment options. Please contact our sales team if you have any questions.
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T/T (Bank Transfer) Receiving: 1-4 days. |
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If you don't want to use our shipping service, you can also arrange pick up from our warehouse or ship by your courier account.
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DHL EXPRESS Delivery time: 1-3 days. |
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FEDEX EXPRESS Delivery time: 1-3 days. |
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UPS EXPRESS Delivery time: 2-4 days. |
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TNT EXPRESS Delivery time: 3-6 days. |
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EMS EXPRESS Delivery time: 7-10 days. |
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Distributor of Lattice Semiconductor Corporation
- Lattice Semiconductor, founded in 1983 and headquartered in Portland, Oregon, is the global leader in smart connectivity solutions. They provide market leading intellectual property and low-power, small form-factor devices that enable more than 8,000 global customers to quickly deliver innovative and differentiated cost and power efficient products. The Company's broad end-market exposure extends from consumer electronics to industrial equipment, communications infrastructure and licensing.