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APT66F60B2
| EXSHINE Part Number: | EX-APT66F60B2 |
|---|---|
| Manufacturer Part Number: | APT66F60B2 |
| Manufacturer / Brand: | Microsemi |
| Brief Description: | MOSFET N-CH 600V 70A TO-247 |
| Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
| Condition: | New and unused, Original |
| Datasheet Download: | APT66F60B2,60L |
| Application: | - |
| Weight: | - |
| Alternative Replacement: | - |
Real Time Availability for
APT66F60B2
In stock: 37730 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks
In stock: 37730 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks
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- Packaging
Product Parameter
| Vgs(th) (Max) @ Id | 5V @ 2.5mA |
|---|---|
| Vgs (Max) | ±30V |
| Technology | MOSFET (Metal Oxide) |
| Supplier Device Package | T-MAX™ [B2] |
| Series | POWER MOS 8™ |
| Rds On (Max) @ Id, Vgs | 90 mOhm @ 33A, 10V |
| Power Dissipation (Max) | 1135W (Tc) |
| Packaging | Tube |
| Package / Case | TO-247-3 Variant |
| Operating Temperature | -55°C ~ 150°C (TJ) |
| Mounting Type | Through Hole |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Manufacturer Standard Lead Time | 22 Weeks |
| Manufacturer Part Number | APT66F60B2 |
| Input Capacitance (Ciss) (Max) @ Vds | 13190pF @ 25V |
| Gate Charge (Qg) (Max) @ Vgs | 330nC @ 10V |
| FET Type | N-Channel |
| FET Feature | - |
| Expanded Description | N-Channel 600V 70A (Tc) 1135W (Tc) Through Hole T-MAX™ [B2] |
| Drive Voltage (Max Rds On, Min Rds On) | 10V |
| Drain to Source Voltage (Vdss) | 600V |
| Description | MOSFET N-CH 600V 70A TO-247 |
| Current - Continuous Drain (Id) @ 25°C | 70A (Tc) |
Others
| Standard Package | 30 |
|---|
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Distributor of Microsemi Corporation
- Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of semiconductor and system solutions for aerospace & defense, communications, data center and industrial markets. Products include high-performance and radiation-hardened analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and synchronization devices and precise time solutions, setting the world’s standard for time; voice processing devices; RF solutions; discrete components; enterprise storage and communication solutions, security technologies and scalable anti-tamper products; Ethernet solutions; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services. Microsemi is headquartered in Aliso Viejo, Calif., and has approximately 4,800 employees globally.
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