APTGT75DDA60T3G

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EXSHINE Part Number:	EX-APTGT75DDA60T3G
Manufacturer Part Number:	APTGT75DDA60T3G
Manufacturer / Brand:	Microsemi
Brief Description:	IGBT MOD TRENCH DL BST CHOP SP3
Lead Free Status / RoHS Status:	Lead free / RoHS Compliant
Condition:	New and unused, Original
Datasheet Download:	APTGT75DDA60T3G Power Products Catalog
Application:	-
Weight:	-
Alternative Replacement:	-

Real Time Availability for

APTGT75DDA60T3G
In stock: 12970 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks

Description
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Packaging

Product Parameter

Voltage - Collector Emitter Breakdown (Max)	600V
Vce(on) (Max) @ Vge, Ic	1.9V @ 15V, 75A
Supplier Device Package	SP3
Series	-
Power - Max	250W
Package / Case	SP3
Operating Temperature	-40°C ~ 175°C (TJ)
NTC Thermistor	Yes
Mounting Type	Chassis Mount
Moisture Sensitivity Level (MSL)	1 (Unlimited)
Manufacturer Standard Lead Time	22 Weeks
Manufacturer Part Number	APTGT75DDA60T3G
Input Capacitance (Cies) @ Vce	4.62nF @ 25V
Input	Standard
IGBT Type	Trench Field Stop
Expanded Description	IGBT Module Trench Field Stop Dual Boost Chopper 600V 100A 250W Chassis Mount SP3
Description	IGBT MOD TRENCH DL BST CHOP SP3
Current - Collector Cutoff (Max)	250µA
Current - Collector (Ic) (Max)	100A
Configuration	Dual Boost Chopper

Others

Standard Package	1

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	T/T (Bank Transfer) Receiving: 1-4 days.
	Paypal Receiving: immediately.
	Western Union Receiving: 1-2 hours.
	MoneyGram Receiving: 1-2 hours.
	Alipay Receiving: immediately.

You can choose the below shipping options, contact our sales team to check the shipping cost to your address.

If you don't want to use our shipping service, you can also arrange pick up from our warehouse or ship by your courier account.

	DHL EXPRESS Delivery time: 1-3 days.
	FEDEX EXPRESS Delivery time: 1-3 days.
	UPS EXPRESS Delivery time: 2-4 days.
	TNT EXPRESS Delivery time: 3-6 days.
	EMS EXPRESS Delivery time: 7-10 days.

Distributor of Microsemi Corporation

- Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of semiconductor and system solutions for aerospace & defense, communications, data center and industrial markets. Products include high-performance and radiation-hardened analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and synchronization devices and precise time solutions, setting the world’s standard for time; voice processing devices; RF solutions; discrete components; enterprise storage and communication solutions, security technologies and scalable anti-tamper products; Ethernet solutions; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services. Microsemi is headquartered in Aliso Viejo, Calif., and has approximately 4,800 employees globally.

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