SPB10045E3

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SPB10045E3

EXSHINE Part Number:EX-SPB10045E3
Manufacturer Part Number:SPB10045E3
Manufacturer / Brand:Microsemi
Brief Description:DIODE MODULE 45V 100A SOT227
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Condition:New and unused, Original
Datasheet Download:SPB10035-45
Application:-
Weight:-
Alternative Replacement:-
Real Time Availability for
SPB10045E3
In stock: 14395 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks

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Product Parameter

Voltage - Forward (Vf) (Max) @ If 570mV @ 100A
Voltage - DC Reverse (Vr) (Max) 45V
Supplier Device Package SOT-227
Speed Fast Recovery = 200mA (Io)
Series -
Packaging Tube
Package / Case SOT-227-4, miniBLOC
Other Names SPB10045E3MS
Mounting Type Chassis Mount
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Manufacturer Part Number SPB10045E3
Expanded Description Diode Array 2 Independent Schottky 45V 100A Chassis Mount SOT-227-4, miniBLOC
Diode Type Schottky
Diode Configuration 2 Independent
Description DIODE MODULE 45V 100A SOT227
Current - Reverse Leakage @ Vr 5mA @ 45V
Current - Average Rectified (Io) (per Diode) 100A

Others

Standard Package 1
Other Names SPB10045E3MS

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Distributor of Microsemi Corporation

- Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of semiconductor and system solutions for aerospace & defense, communications, data center and industrial markets. Products include high-performance and radiation-hardened analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and synchronization devices and precise time solutions, setting the world’s standard for time; voice processing devices; RF solutions; discrete components; enterprise storage and communication solutions, security technologies and scalable anti-tamper products; Ethernet solutions; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services. Microsemi is headquartered in Aliso Viejo, Calif., and has approximately 4,800 employees globally.

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