RJK0855DPB-00#J5

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RJK0855DPB-00#J5

EXSHINE Part Number:EX-RJK0855DPB-00#J5
Manufacturer Part Number:RJK0855DPB-00#J5
Manufacturer / Brand:Renesas Electronics America
Brief Description:MOSFET N-CH 80V 30A LFPAK
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Condition:New and unused, Original
Datasheet Download:RJK0855DPB
Application:-
Weight:-
Alternative Replacement:-
Real Time Availability for
RJK0855DPB-00#J5
In stock: 61350 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks

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US$ 1.049

Reference Marketing Price: US$ 1.049

Our Best Price: N/A (Email us)

Minimum:1

Multiples:1

2500+:
$1.049
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Product Parameter

Vgs(th) (Max) @ Id -
Technology MOSFET (Metal Oxide)
Supplier Device Package LFPAK
Series -
Rds On (Max) @ Id, Vgs 11 mOhm @ 15A, 10V
Power Dissipation (Max) 60W (Tc)
Packaging Tape & Reel (TR)
Package / Case SC-100, SOT-669
Other Names RJK0855DPB-00#J5-ND
RJK0855DPB-00#J5TR
Operating Temperature 150°C (TJ)
Mounting Type Surface Mount
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Manufacturer Standard Lead Time 16 Weeks
Manufacturer Part Number RJK0855DPB-00#J5
Input Capacitance (Ciss) (Max) @ Vds 2550pF @ 10V
Gate Charge (Qg) (Max) @ Vgs 35nC @ 10V
FET Type N-Channel
FET Feature -
Expanded Description N-Channel 80V 30A (Ta) 60W (Tc) Surface Mount LFPAK
Drain to Source Voltage (Vdss) 80V
Description MOSFET N-CH 80V 30A LFPAK
Current - Continuous Drain (Id) @ 25°C 30A (Ta)

Others

Other Names RJK0855DPB-00#J5-ND

RJK0855DPB-00#J5TR
Standard Package 2,500

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Distributor of Renesas Electronics America

- Renesas Electronics America designs and manufactures highly integrated semiconductor system solutions for automotive, mobile and PC/AV markets. Established on April 1, 2003, as a joint venture between Hitachi, Ltd. and Mitsubishi Electric Corporation and headquartered in Tokyo, Japan, Renesas is one of the largest semiconductor companies in the world and the world-leading microcontroller supplier globally. Besides microcontrollers, Renesas offers system-on-chip devices, smart card ICs, mixed-signal products, flash memories, SRAMs and more.

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