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TC114-2830-L-S

EXSHINE Part Number:EX-TC114-2830-L-S
Manufacturer Part Number:TC114-2830-L-S
Manufacturer / Brand:Samtec, Inc.
Brief Description:CONTACT PIN 28-30AWG CRIMP GOLD
Lead Free Status / RoHS Status:
Condition:New and unused, Original
Datasheet Download:TC114-2830-L-S
Application:-
Weight:-
Alternative Replacement:-
Real Time Availability for
TC114-2830-L-S
In stock: 99734000 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks

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Reference Marketing Price: US$ 0.23

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Product Parameter

Wire Gauge or Range - mm² -
Wire Gauge or Range - Coaxial -
Wire Gauge or Range - AWG 28-30 AWG
Type Signal
Termination Finish -
Series AccliMate™ TC114
Packaging Strip
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Manufacturer Standard Lead Time 3 Weeks
Manufacturer Part Number TC114-2830-L-S
Features Insulation Support
Expanded Description Pin Contact 28-30 AWG Size Crimp Gold
Description CONTACT PIN 28-30AWG CRIMP GOLD
Contact Type Pin
Contact Termination Crimp
Contact Size -
Contact Material Phosphor Bronze
Contact Finish Thickness 10µin (0.25µm)
Contact Finish Gold

Others

Standard Package 1

You can choose the below payment options. Please contact our sales team if you have any questions.

 T/T (Bank Transfer)
 Receiving: 1-4 days.

 Paypal
 Receiving: immediately.

 Western Union
 Receiving: 1-2 hours.

 MoneyGram
 Receiving: 1-2 hours.

 Alipay
 Receiving: immediately.

You can choose the below shipping options, contact our sales team to check the shipping cost to your address.
If you don't want to use our shipping service, you can also arrange pick up from our warehouse or ship by your courier account.

 DHL EXPRESS
 Delivery time: 1-3 days.
 FEDEX EXPRESS
 Delivery time: 1-3 days.
 UPS EXPRESS
 Delivery time: 2-4 days.
 TNT EXPRESS
 Delivery time: 3-6 days.
 EMS EXPRESS
 Delivery time: 7-10 days.


Distributor of Samtec Inc.

is a worldwide manufacturer of P.C. Board level interconnects. Samtec is a global manufacturer of a broad line of electronic interconnect solutions, including micro pitch board-to-board systems (on .100”, 2 mm, .050”, 1 mm, .8 mm, .635 mm, .5 mm, and .4 mm pitch), high-speed mezzanine systems, high-density arrays, IC-to-Board, Future-Proof/Active Optics, rugged/power systems, and cable assemblies (IDC, discrete wire, sealed/circulars, and high speed).
To meet the interconnect challenges of tomorrow and beyond, Samtec has developed Technology Centers dedicated to developing and advancing technologies and products that provide both performance and cost benefits, ensuring complete system optimization from the bare die to an interface 100 meters away, and all interconnect points in between.

With 33 locations in 18 different countries, including manufacturing facilities in New Albany, Colorado, Oregon, Costa Rica, China, Malaysia and Singapore, Samtec’s global presence enables its unmatched customer service.
Samtec was founded in 1976, is privately held, and is ISO 9001 and TS 16949 certified with a 5-A1 Dun and Bradstreet rating, the highest available for a corporation this size. Samtec is recognized as the service leader in the connector industry.

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