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TSM-105-01-F-SH-A-TR

EXSHINE Part Number:EX-TSM-105-01-F-SH-A-TR
Manufacturer Part Number:TSM-105-01-F-SH-A-TR
Manufacturer / Brand:Samtec, Inc.
Brief Description:.025 SQ. TERMINAL STRIPS
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Condition:New and unused, Original
Datasheet Download:TSM-1 Series Drawing
Application:-
Weight:-
Alternative Replacement:-
Real Time Availability for
TSM-105-01-F-SH-A-TR
In stock: 92380 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks

Click below to order TSM-105-01-F-SH-A-TR online

US$ 1.294

Reference Marketing Price: US$ 1.294

Our Best Price: N/A (Email us)

Minimum:1

Multiples:1

125+:
$1.294
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Product Parameter

Voltage Rating -
Termination Solder
Style Board to Board or Cable
Shrouding Unshrouded
Series TSM
Row Spacing - Mating -
Pitch - Mating 0.100" (2.54mm)
Packaging Tape & Reel (TR)
Overall Contact Length -
Operating Temperature -55°C ~ 125°C
Number of Rows 1
Number of Positions Loaded All
Number of Positions 5
Mounting Type Surface Mount, Right Angle
Material Flammability Rating UL94 V-0
Mated Stacking Heights -
Manufacturer Standard Lead Time 3 Weeks
Manufacturer Part Number TSM-105-01-F-SH-A-TR
Insulation Material Liquid Crystal Polymer (LCP)
Insulation Height 0.120" (3.05mm)
Insulation Color Black
Ingress Protection -
Features Board Guide
Fastening Type -
Expanded Description 5 Positions Header Connector Surface Mount, Right Angle
Description .025 SQ. TERMINAL STRIPS
Current Rating -
Contact Type Male Pin
Contact Shape Square
Contact Material Phosphor Bronze
Contact Length - Post -
Contact Length - Mating 0.230" (5.84mm)
Contact Finish Thickness - Post -
Contact Finish Thickness - Mating 3µin (0.08µm)
Contact Finish - Post Tin
Contact Finish - Mating Gold
Connector Type Header
Applications -

Others

Standard Package 125

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Distributor of Samtec Inc.

is a worldwide manufacturer of P.C. Board level interconnects. Samtec is a global manufacturer of a broad line of electronic interconnect solutions, including micro pitch board-to-board systems (on .100”, 2 mm, .050”, 1 mm, .8 mm, .635 mm, .5 mm, and .4 mm pitch), high-speed mezzanine systems, high-density arrays, IC-to-Board, Future-Proof/Active Optics, rugged/power systems, and cable assemblies (IDC, discrete wire, sealed/circulars, and high speed).
To meet the interconnect challenges of tomorrow and beyond, Samtec has developed Technology Centers dedicated to developing and advancing technologies and products that provide both performance and cost benefits, ensuring complete system optimization from the bare die to an interface 100 meters away, and all interconnect points in between.

With 33 locations in 18 different countries, including manufacturing facilities in New Albany, Colorado, Oregon, Costa Rica, China, Malaysia and Singapore, Samtec’s global presence enables its unmatched customer service.
Samtec was founded in 1976, is privately held, and is ISO 9001 and TS 16949 certified with a 5-A1 Dun and Bradstreet rating, the highest available for a corporation this size. Samtec is recognized as the service leader in the connector industry.

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