HN2C01FEYTE85LF

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HN2C01FEYTE85LF

EXSHINE Part Number:EX-HN2C01FEYTE85LF
Manufacturer Part Number:HN2C01FEYTE85LF
Manufacturer / Brand:Toshiba Semiconductor and Storage
Brief Description:TRANS 2NPN 50V 0.15A ES6
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Condition:New and unused, Original
Datasheet Download:HN2C01FE
Application:-
Weight:-
Alternative Replacement:-
Real Time Availability for
HN2C01FEYTE85LF
In stock: 10185000 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks

Click below to order HN2C01FEYTE85LF online

US$ 0.41

Reference Marketing Price: US$ 0.41

Our Best Price: N/A (Email us)

Minimum:1

Multiples:1

1+:
$0.41
10+:
$0.373
25+:
$0.269
100+:
$0.209
250+:
$0.131
500+:
$0.112
1000+:
$0.076
  • Description
  • Payment
  • Shipping
  • Packaging

Product Parameter

Voltage - Collector Emitter Breakdown (Max) 50V
Vce Saturation (Max) @ Ib, Ic 250mV @ 10mA, 100mA
Transistor Type 2 NPN (Dual)
Supplier Device Package ES6
Series -
Power - Max 100mW
Packaging Cut Tape (CT)
Package / Case SOT-563, SOT-666
Other Names HN2C01FEYTE85LFCT
Operating Temperature 150°C (TJ)
Mounting Type Surface Mount
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Manufacturer Part Number HN2C01FEYTE85LF
Frequency - Transition 60MHz
Expanded Description Bipolar (BJT) Transistor Array 2 NPN (Dual) 50V 150mA 60MHz 100mW Surface Mount ES6
Description TRANS 2NPN 50V 0.15A ES6
DC Current Gain (hFE) (Min) @ Ic, Vce 120 @ 2mA, 6V
Current - Collector Cutoff (Max) 100nA (ICBO)
Current - Collector (Ic) (Max) 150mA

Others

Standard Package 1
Other Names HN2C01FEYTE85LFCT

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If you don't want to use our shipping service, you can also arrange pick up from our warehouse or ship by your courier account.

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 Delivery time: 1-3 days.
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 UPS EXPRESS
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 Delivery time: 3-6 days.
 EMS EXPRESS
 Delivery time: 7-10 days.


Distributor of Toshiba Semiconductor and Storage

- Toshiba Semiconductor & Storage offers a broad range of enabling technology solutions that allow OEMs, ODMs, CMs and fabless chip companies to develop advanced integrated products for the computing, networking, communications, digital consumer, automotive and other markets.

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