EXSHINE Part Number: | EX-HN1C01FE-GR,LF |
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Manufacturer Part Number: | HN1C01FE-GR,LF |
Manufacturer / Brand: | Toshiba Semiconductor and Storage |
Brief Description: | TRANS 2NPN 50V 0.15A ES6 |
Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
Condition: | New and unused, Original |
Datasheet Download: | HN1C01FE |
Application: | - |
Weight: | - |
Alternative Replacement: | - |
Voltage - Collector Emitter Breakdown (Max) | 50V |
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Vce Saturation (Max) @ Ib, Ic | 250mV @ 10mA, 100mA |
Transistor Type | 2 NPN (Dual) |
Supplier Device Package | ES6 |
Series | - |
Power - Max | 100mW |
Packaging | Tape & Reel (TR) |
Package / Case | SOT-563, SOT-666 |
Other Names | HN1C01FE-GR (5L,F,T HN1C01FE-GR(5L,F,T HN1C01FE-GR(5LFTTR HN1C01FE-GR(5LFTTR-ND HN1C01FE-GR,LF(B HN1C01FE-GR,LF(T HN1C01FE-GRLFTR |
Operating Temperature | 150°C (TJ) |
Mounting Type | Surface Mount |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Manufacturer Standard Lead Time | 16 Weeks |
Manufacturer Part Number | HN1C01FE-GR,LF |
Frequency - Transition | 80MHz |
Expanded Description | Bipolar (BJT) Transistor Array 2 NPN (Dual) 50V 150mA 80MHz 100mW Surface Mount ES6 |
Description | TRANS 2NPN 50V 0.15A ES6 |
DC Current Gain (hFE) (Min) @ Ic, Vce | 200 @ 2mA, 6V |
Current - Collector Cutoff (Max) | 100nA (ICBO) |
Current - Collector (Ic) (Max) | 150mA |
Other Names | HN1C01FE-GR (5L,F,T HN1C01FE-GR(5L,F,T HN1C01FE-GR(5LFTTR HN1C01FE-GR(5LFTTR-ND HN1C01FE-GR,LF(B HN1C01FE-GR,LF(T HN1C01FE-GRLFTR |
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Standard Package | 4,000 |
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T/T (Bank Transfer) Receiving: 1-4 days. |
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Paypal Receiving: immediately. |
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Western Union Receiving: 1-2 hours. |
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MoneyGram Receiving: 1-2 hours. |
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Alipay Receiving: immediately. |
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DHL EXPRESS Delivery time: 1-3 days. |
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FEDEX EXPRESS Delivery time: 1-3 days. |
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UPS EXPRESS Delivery time: 2-4 days. |
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TNT EXPRESS Delivery time: 3-6 days. |
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EMS EXPRESS Delivery time: 7-10 days. |
- Toshiba Semiconductor & Storage offers a broad range of enabling technology solutions that allow OEMs, ODMs, CMs and fabless chip companies to develop advanced integrated products for the computing, networking, communications, digital consumer, automotive and other markets.