TLP716(TP,F)

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TLP716(TP,F)

EXSHINE Part Number:EX-TLP716(TP,F)
Manufacturer Part Number:TLP716(TP,F)
Manufacturer / Brand:Toshiba Semiconductor and Storage
Brief Description:OPTOISO 5KV PUSH PULL 6DIP GW
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Condition:New and unused, Original
Datasheet Download:TLP716 Photocouplers/Relays Catalog -
Application:-
Weight:-
Alternative Replacement:-
Real Time Availability for
TLP716(TP,F)
In stock: 72319000 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks

Click below to order TLP716(TP,F) online

US$ 0.688

Reference Marketing Price: US$ 0.688

Our Best Price: N/A (Email us)

Minimum:1

Multiples:1

1500+:
$0.688
3000+:
$0.65
7500+:
$0.625
10500+:
$0.613
  • Description
  • Payment
  • Shipping
  • Packaging

Product Parameter

Voltage - Supply 4.5 V ~ 5.5 V
Voltage - Isolation 5000Vrms
Voltage - Forward (Vf) (Typ) 1.65V
Supplier Device Package 6-SDIP Gull Wing
Series -
Rise / Fall Time (Typ) 15ns, 15ns
Propagation Delay tpLH / tpHL (Max) 75ns, 75ns
Packaging Tape & Reel (TR)
Package / Case 6-SOIC (0.268", 6.80mm Width)
Output Type Push-Pull, Totem Pole
Other Names TLP716 (TP,F)
TLP716(TPF)TR
TLP716FTR
TLP716FTR-ND
TLP716TPF
Operating Temperature -40°C ~ 100°C
Number of Channels 1
Mounting Type Surface Mount
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Manufacturer Standard Lead Time 16 Weeks
Manufacturer Part Number TLP716(TP,F)
Inputs - Side 1/Side 2 1/0
Input Type DC
Expanded Description Logic Output Optoisolator 15MBd Push-Pull, Totem Pole 5000Vrms 1 Channel 10kV/µs CMTI 6-SDIP Gull Wing
Description OPTOISO 5KV PUSH PULL 6DIP GW
Data Rate 15MBd
Current - Output / Channel 10mA
Current - DC Forward (If) (Max) 20mA
Common Mode Transient Immunity (Min) 10kV/µs

Others

Other Names TLP716 (TP,F)

TLP716(TPF)TR

TLP716FTR

TLP716FTR-ND

TLP716TPF
Standard Package 1,500

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Distributor of Toshiba Semiconductor and Storage

- Toshiba Semiconductor & Storage offers a broad range of enabling technology solutions that allow OEMs, ODMs, CMs and fabless chip companies to develop advanced integrated products for the computing, networking, communications, digital consumer, automotive and other markets.

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